Optical Fiber Packaging
Optical Fiber Packaging's (OFPs) factory is conveniently located close to Cambridge
Optical Fiber Packaging's US facilities are located right outside of Chicago
Optical Fiber Packaging's (OFPs) factory is conveniently located close to Cambridge
FVA Assemblies for Transceivers
Fiber Vee Groove Array Types
OFP manufactures a wide range of specialty FVA products for coupling optical fiber channels with extreme precision and reliability to active devices as PICs, VCSELs, and free space collimating arrays (MLAs). FVA assemblies are commonly used in applications such as high speed Coherent Receivers and Parallel Transceivers in combination with hermetic sealing feedthroughs.
OFP's engineers can help design highly customized low cost FVA assemblies, ready for mass production for high reliability photonic applications.
Customer Options
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Available with TIR (90 deg reflection) designs of protruded laser ablated fiber array or angle polished.
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Custom AR coatings available on FVA end-face
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For SM, PM, MM, PCF, Hollow-Core, Mid-IR, and hybrid array of fibers
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Excellent PER performance on PM fiber
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Fan-out assemblies to all connector types: FC, SC, LC, MT etc with ribbon or discrete fibers
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Telecordia GR-1221-CORE and Mil specs compliant
Key Features
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Fiber counts: 1, 2, 4, 8, 16, 24, 32, 48, 64, 80, 96
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Core pitch: 127 um, 250 um, 500 um, 1 mm. Custom pitch possible.
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Materials: Quartz, Pyrex, Silicon, Tempax, BK-7, or other materials
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Single layer or dual layer
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End-face polish accuracy < +/- 1 degree. Customer specified angles
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Can be ultra small (1x1 mm to fit through package pipes).
