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Fiber Optic Components

EMI Shielding
Receptacles

OFP's Mini Adapters avoid the use of traditional cable or BTW LC connectors within pluggable modules like transceivers, which typically contain pigtailed fibers. 

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This space saving allows the customer to maximize "real estate" for other critical opto-electronic hardware and fiber components. 

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OFP's Mini Adapters can be customized to suit many applications: 

  • Polymer choices & color options

  • Die-cast versions

  • Various ferrule retentions

  • Different flange positions and mounting options

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EMI Shielding Receptacle

Key Features

  • Single mode & multimode

  • Available with EMI/EMF shielding polymer

  • Telcordia GR326 qualified

  • UL-94, V0 rated

  • Available as kits and/or with miniature pigtails for active device side

Machined Components for Optronics

OFP offers a wide range of packaging components for optical and micro-electronic applications.​

All of our products are machined to a high precision; we also provide rapid prototyping and fast-scaling to mass production. Many value added services are available such as hermetic sealing of pins and post-machining assembly.

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Materials include: Kovar, Brass, CuW alloys, CuNi alloys, Aluminum, Nimonic alloys, alternative alloys

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Post machining services include: Added windows, RF Out connectors, Plating, Polishing, Anodic Oxidation, Laser machining, and Partial plating

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Gold Box for Optronics
Machined Component for Optronics

Product Types

  • Metal hermetic packages

  • TOSA/ROSA components

  • Hypo-tubes/feedthrough tubes

  • All-in-one structures

  • Device mounts/Heat sinks

  • TO Caps

  • Lids/Weld Spacers

  • Receptacle components

Thermoelectric Coolers
(TECs)

OFP has access to a wide variety of TECs (thermoelectric coolers). With over 5,000 types, we can find the right TEC for your application. 

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The TECs range from 0.5x0.5mm to 40x40mm or larger and are available in single or multi-stage designs. 

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The TECs are perfectly designed for use in packages and laser applications where extra cooling is necessary.

Coming Soon
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Thermoelectric Cooler

Key Features

  • Up to 40 W per square cm of cooling power density 

  • Sn-Sb assembly solder with ultra-high 230 C melting point 

  • From 0.5 x 0.5 mm, to over 40 x 40 mm

  • Easy to customize with special ceramics or wires 

  • Gold plating or metallization is available 

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