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Fiber Optic Components

EMI Shielding

OFP's Mini Adapters avoid the use of traditional cable or BTW LC connectors within pluggable modules like transceivers, which typically contain pigtailed fibers. 

This space saving allows the customer to maximize "real estate" for other critical opto-electronic hardware and fiber components. 

OFP's Mini Adapters can be customized to suit many applications: 

  • Polymer choices & color options

  • Die-cast versions

  • Various ferrule retentions

  • Different flange positions and mounting options

EMI Shielding Receptacle

Key Features

  • Single mode & multimode

  • Available with EMI/EMF shielding polymer

  • Telcordia GR326 qualified

  • UL-94, V0 rated

  • Available as kits and/or with miniature pigtails for active device side

Machined Components for Optronics

OFP offers a wide range of packaging components for optical and micro-electronic applications.​

All of our products are machined to a high precision; we also provide rapid prototyping and fast-scaling to mass production. Many value added services are available such as hermetic sealing of pins and post-machining assembly.

Materials include: Kovar, Brass, CuW alloys, CuNi alloys, Aluminum, Nimonic alloys, alternative alloys

Post machining services include: Added windows, RF Out connectors, Plating, Polishing, Anodic Oxidation, Laser machining, and Partial plating

Gold Box for Optronics
Machined Component for Optronics

Product Types

  • Metal hermetic packages

  • TOSA/ROSA components

  • Hypo-tubes/feedthrough tubes

  • All-in-one structures

  • Device mounts/Heat sinks

  • TO Caps

  • Lids/Weld Spacers

  • Receptacle components

Thermoelectric Coolers

OFP has access to a wide variety of TECs (thermoelectric coolers). With over 5,000 types, we can find the right TEC for your application. 

The TECs range from 0.5x0.5mm to 40x40mm or larger and are available in single or multi-stage designs. 

The TECs are perfectly designed for use in packages and laser applications where extra cooling is necessary.

Coming Soon
Thermoelectric Cooler

Key Features

  • Up to 40 W per square cm of cooling power density 

  • Sn-Sb assembly solder with ultra-high 230 C melting point 

  • From 0.5 x 0.5 mm, to over 40 x 40 mm

  • Easy to customize with special ceramics or wires 

  • Gold plating or metallization is available 

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